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S71GL016A Based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
16 Megabit (1M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory 4 Megabit (256K x 16-bit) pSRAM
Data Sheet (Advance Information)
S71GL016A Based MCPs Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71GL016A_00
Revision A
Amendment 1
Issue Date June 20, 2006
Data
Sheet
(Advance
Information)
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance Information content:
"This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice."
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:
"This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications."
Combination
Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion LLC applies the following conditions to documents in this category:
"This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur."
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
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S71GL016A Based MCPs
S71GL016A_00_A1 June 20, 2006
S71GL016A Based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
16 Megabit (1M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory 4 Megabit (256K x 16-bit) pSRAM
Data Sheet (Advance Information)
Features
Power supply voltage of 2.7 V to 3.1 V High performance
- 100 ns (100 ns Flash, 70 ns pSRAM/SRAM)
Packages
- 7 x 9 x 1.2 mm 56 ball FBGA
Operating Temperature
- -25C to +85C
General Description
The S71GL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: One S29GL016A Flash memory die pSRAM The products covered by this document are listed in the table below:
Flash Memory Density 16Mb pSRAM Density 4Mb S71GL016A40
For detailed specifications, please refer to the individual data sheets.
.
Document S29GL-A pSRAM Type 4
Publication Identification Number (PID) S29GL-A_00 psram_18
Publication Number S71GL016A_00
Revision A
Amendment 1
Issue Date June 20, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advance
Information)
1.
Product Selector Guide
Device-Model# S71GL016A40-1J 100 S71GL016A40-3J 4 M pSRAM 70 Type 4 TLC056 Flash Access time (ns) pSRAM density pSRAM Access time (ns) pSRAM type Package
2. MCP Block Diagram
VCCf
VCC CE# WP#/ACC RESET# Flash-only Address Shared Address OE# WE# VSS RY/BY# Flash
VCCS
DQ15 to DQ0
VCC pSRAM/SRAM
IO15-IO0 CE#s UB#s LB#s CE2 CE# UB# LB# CE2
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S71GL016A Based MCPs
S71GL016A_00_A1 June 20, 2006
Data
Sheet
(Advance
Information)
3.
Connection Diagram
Figure 3.1 56-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down)
A2 A7 B1 A3 C1 A2 D1 A1 E1 A0 F1 CE1#f G1 CE1#s B2 A6 C2 A5 D2 A4 E2 VSS F2 OE# G2 DQ0 H2 DQ8
A3 LB# B3 UB# C3 A18 D3 A17 E3 DQ1 F3 DQ9 G3 DQ10 H3 DQ2
A4 WP/ACC B4 RST#f C4 RY/BY#
A5 WE# B5 CE2s C5 RFU
A6 A8 B6 A19 C6 A9 D6 A10 E6 DQ6
A7 A11 B7 A12 C7 A13 D7 A14 E7 RFU F7 DQ15 G7 DQ7 H7 DQ14 B8
Legend
Shared
A15 C8 RFU D8 RFU
Flash only
RAM only
E8 A16 F8 RFU G8 VSS
F4 DQ3 G4 VCCf H4 DQ11
F5 DQ4 G5 VCCs H5 RFU
F6 DQ13 G6 DQ12 H6 DQ5
Reserved for Future Use
June 20, 2006 S71GL016A_00_A1
S71GL016A Based MCPs
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Data
Sheet
(Advance
Information)
4.
Pin Description
A19-A0 DQ15-DQ0 CE#f CE#s OE# WE# RY/BY# UB# LB# RESET# WP#/ACC VCCf VCCs VSS NC = = = = = = = = = = = = = = = 20 Address Inputs (Common and Flash only) 16 Data Inputs/Outputs (Common) Chip Enable (Flash) Chip Enable 1 (pSRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Output (Flash 1) Upper Byte Control (pSRAM/SRAM) Lower Byte Control (pSRAM/SRAM) Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) pSRAM/SRAM Power Supply Device Ground (Common) Pin Not Connected Internally
5. Logic Symbol
21 A20-A0
16 CE#f DQ15-DQ0
CE1#s CE2s OE# WE# WP#/ACC RESET# UB# LB# RY/BY#
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S71GL016A Based MCPs
S71GL016A_00_A1 June 20, 2006
Data
Sheet
(Advance
Information)
6.
Ordering Information
The order number is formed by a valid combinations of the following:
S71GL
016
A
40
BA
W
3J
0 Packing Type 0 = Tray 2 = 7" Tape and Reel 3 = 13" Tape and Reel Model Number See the Valid Combinations table Temperature Range W = Wireless (-25xC to +85xC) Package Type BA = Fine-pitch BGA Lead (Pb)-free compliant package BF = Fine-pitch BGA Lead (Pb)-free package pSRAM Density 40 = 4 Mb pSRAM Process Technology A = 200 nm, MirrorBit Technology Flash Density 016= 16Mb Product Family S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM
6.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations.
Base Ordering Part Number S71GL016A40 BAW S71GL016A40 S71GL016A40 BFW S71GL016A40 1J 100 / Top Boot Sector 1J 3J 100 / Top Boot Sector 0, 2, 3 (See Note) 100 / Bottom Boot Sector pSRAM4/ 70 TLC056 Package & Temperature Package Modifier/ Model Number 3J Packing Type Speed Options (ns)/ Boot Sector Option 100 / Bottom Boot Sector pSRAM Type/ Access Time (ns) Package Marking
Note: Type 0 is standard. Specify other options as required.
June 20, 2006 S71GL016A_00_A1
S71GL016A Based MCPs
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Data
Sheet
(Advance
Information)
7.
Physical Dimensions
Figure 7.1 TLC056--56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm
D
0.15 C (2X)
8 7 6
A
D1 eD
SE
7
E eE
5 4 3 2 1
E1
INDEX MARK PIN A1 CORNER 10
H
G
F
E
D
CB
A
B
7
TOP VIEW
0.15 C (2X)
SD
PIN A1 CORNER
BOTTOM VIEW
0.20 C
A A2 A1
6
C
0.08 C
SIDE VIEW b
56X
0.15 M C A B 0.08 M C
NOTES: PACKAGE JEDEC DxE SYMBOL A A1 A2 D E D1 E1 MD ME n b eE eD SD / SE 0.35 TLC 056 N/A 9.00 mm x 7.00 mm PACKAGE MIN --0.20 0.81 NOM ------9.00 BSC. 7.00 BSC. 5.60 BSC. 5.60 BSC. 8 8 56 0.40 0.80 BSC. 0.80 BSC 0.40 BSC. A1,A8,D4,D5,E4,E5,H1,H8 0.45 MAX 1.20 --0.97 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALLS 9. 8. 7 6 NOTE 2. 3. 4. 5. 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3348 \ 16-038.22a
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S71GL016A Based MCPs
S71GL016A_00_A1 June 20, 2006
Data
Sheet
(Advance
Information)
8.
Revision History
Section Description
Revision A (May 17, 2005) Initial Release Revision A1 (June 20, 2006) Global General Description Data sheet updated to new template Added a table referencing the individual specification documents for the Flash and pSRAM data sheets
Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2005-2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.
June 20, 2006 S71GL016A_00_A1
S71GL016A Based MCPs
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